Method of manufacturing semiconductor device and computer readable medium for storing pattern size setting program
AssigneeKabushiki Kaisha Toshiba
InventorsHiromitsu Mashita, Toshiya Kotani, Fumiharu Nakajima, Takafumi Taguchi, Chikaaki Kodama
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Abstract
A method of manufacturing a semiconductor device, which forms a pattern by performing pattern transformation steps multiple times, comprises setting finished pattern sizes for patterns to be formed in each consecutive two pattern transformation steps among the plurality of pattern transformation steps based on a possible total amount of in-plane size variation of the patterns to be formed in the consecutive two pattern transformation steps.
Claims3
A non-transitory computer readable medium for storing a pattern size setting program, which sets a size of a pattern formed through multiple pattern transformation steps, comprising:
- instructions for calculating an amount of in-plane size variation after pattern transformation step, wherein the amount of in-plane size variation is calculated for each one of a plurality of pattern transformation steps in forming a final pattern on a predetermined layer by performing the plurality of pattern transformation steps;
- instructions for calculating a total amount of in-plane size variation of that calculated for each one of the plurality of pattern transformation steps;
- instructions for setting a finished pattern size of the final pattern based on the total amount of in-plane size variation;
- and
- instructions for setting a finished pattern size for each one of the plurality of pattern transformation steps based on the finished pattern size of the final pattern.
Dependencies are inferred from the claim text.