Package substrate dynamic pressure structure

A method comprising providing a package substrate and a region on the package substrate adapted to receive an electronic component thereon;

• positioning a shape memory material structure on the package substrate, the shape memory material structure comprising a shape memory material having a phase transformation temperature in the range of 50 to 300 degrees Celsius, wherein the positioning includes positioning the shape memory material structure to extend around the region;
• positioning an electronic component on the region;
• and
• heating the package substrate having the shape memory material structure and the electronic component positioned thereon to a temperature not less than the phase transformation temperature of the shape memory material, wherein the heating causes the shape memory material structure to apply force to the package substrate in a manner that inhibits warpage of the package substrate.