Photosensitive resin composition and pattern forming method using the same
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsTakahiro Senzaki, Koichi Misumi, Atsushi Yamanouchi, Koji Saito
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Abstract
Problem: Providing a photosensitive resin composition that has high sensitivity, sustains a slight shrinkage in volume when cured under heating and can form resist patterns having high-aspect profiles, and a pattern forming method using such a composition. Means for Resolution: A photosensitive resin composition characterized by containing (a) a polyfunctional epoxy resin, (b) a cationic polymerization initiator and (c) an aromatic polycyclic compound as a sensitizer (such as 2,3-dihydroxynaphthalene, 1,5-dihydroxynaphthalene or 2,6-dihydroxynaphthalene), which has at least two substituents capable of forming cross-links with component (a).
Claims10
A photosensitive resin composition comprising (a) a polyfunctional epoxy resin, (b) a cationic polymerization initiator, and (c) an aromatic polycyclic compound as a sensitizer, which has at least two substituents capable of forming cross-links with component (a),
- wherein component (a) is a polyfunctional bisphenol A novolak epoxy resin, and
- wherein component (c) is selected from the group consisting of mononaphthalene compounds, dinaphthalene compounds, anthracene compounds, phenanthroline compounds, and mixtures thereof.
Dependencies are inferred from the claim text.