Magnetron sputtering apparatus

A magnetron sputtering apparatus in which a target is disposed to face a substrate to be processed installed in a vacuum chamber, the apparatus comprising:

• a power supply unit configured to apply a voltage to the target;
• and
• a magnet array body provided at a rear side of the target and comprising a base body and a magnet group arranged on the base body,
• wherein:
• the magnet group comprises rod-shaped magnets each having different polarities at opposite ends thereof, and permeable core members;
• the rod-shaped magnets are disposed in a mesh shape on a surface of the base body facing the target;
• the permeable core members are disposed at intersection points of the mesh shape, such that the permeable core members are surrounded by the ends of the rod-shaped magnets;
• the mesh shape is a polygon with 2n sides, n being an integer equal to or greater than 2;
• end portions of the rod-shaped magnets which surround each of the core members have a same polarity;
• and
• the core members lie on a same plane as the rod-shaped magnets.