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US 8,575,718 B2Granted
Programmable electrical fuse
AssigneeInternational Business Machines Corporation
InventorsMichael J. Abou-Khalil, Robert J. Gauthier, Jr., Tom C. Lee, Junjun Li, Souvick Mitra, Christopher S. Putnam, William Tonti
Life of this patent
Estimating the term…
Abstract
The present invention relates to e-fuse devices, and more particularly to a device and method of forming an e-fuse device, the method comprising providing a first conductive layer connected to a second conductive layer, the first and second conductive layers separated by a barrier layer having a first diffusivity different than a second diffusivity of the first conductive layer. A void is created in the first conductive layer by driving an electrical current through the e-fuse device.
Claims19
An electrical-fuse (e-fuse) device comprising:
- a first section of a first conductive layer and a second section of said first conductive layer that are laterally spaced from each other;
- a second conductive layer vertically separated from said first and second sections of said first conductive layer;
- an insulating layer comprising a dielectric material and located between said first conductive layer and said second conductive layer;
- at least one first via electrically connecting said first section of said first conductive layer and said second conductive layer and including side surfaces that contact said dielectric material of said insulating layer;
- and
- a combination of a second via and a barrier layer in a U-shaped configuration, said combination electrically connecting said second section of said first conductive layer and said second conductive layer and embedded within said insulating layer, wherein said second via has a same material composition as said at least one first via and is spaced from said dielectric material of said insulating layer by said barrier layer, and said barrier layer comprises a horizontal portion and vertical portions that extend upward from a periphery of said horizontal portion and embeds said second via therein, wherein a bottom surface of said horizontal portion of said barrier layer contacts said second section of said first conductive layer.
3 more elements
An electrical-fuse (e-fuse) device comprising:
- a first section of a first conductive layer and a second section of said first conductive layer that are laterally spaced from each other;
- a second conductive layer vertically separated from said first and second sections of said first conductive layer;
- an insulating layer comprising a dielectric material and located between said first conductive layer and said second conductive layer;
- at least one first via comprising a metal material and electrically connecting said first section of said first conductive layer and said second conductive layer;
- a combination of a second via, a barrier layer in a U-shaped configuration, and a dielectric spacer laterally contacting, and surrounding, said barrier layer and comprising a different dielectric material than said dielectric material of said insulating layer, said combination electrically connecting said second section of said first conductive layer and said second conductive layer and embedded within said insulating layer, wherein said barrier layer comprises a horizontal portion and vertical portions that extend upward from a periphery of said horizontal portion and embeds said second via therein, wherein a bottom surface of said horizontal portion of said barrier layer contacts said second section of said first conductive layer.
2 more elements
An electrical-fuse (e-fuse) device comprising:
- a first section of a first conductive layer and a second section of said first conductive layer that are laterally spaced from each other;
- a second conductive layer vertically separated from said first and second sections of said first conductive layer;
- an insulating layer comprising a dielectric material and located between said first conductive layer and said second conductive layer;
- at least one first via comprising a metal material and electrically connecting said first section of said first conductive layer and said second conductive layer;
- a combination of a second via and a barrier layer in a U-shaped configuration, said combination electrically connecting said second section of said first conductive layer and said second conductive layer and embedded within said insulating layer, wherein said barrier layer comprises a horizontal portion and vertical portions that extend upward from a periphery of said horizontal portion and embeds said second via therein, wherein a bottom surface of said horizontal portion of said barrier layer contacts said second section of said first conductive layer, wherein an interface between said barrier layer and said second section of said first conductive layer is located above a horizontal interface between said insulating layer and a topmost surface of said second section of said first conductive layer.
2 more elements
Dependencies are inferred from the claim text.