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US 8,574,931 B2Granted
Singulation and strip testing of no-lead integrated circuit packages without tape frame
AssigneeTexas Instruments Incorporated
InventorDonald C Abbott
Life of this patent
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Abstract
Strip testing is applied to a plurality of integrated circuit dies that are each encapsulated in an encapsulant, that each have a set of externally accessible leads connected thereto, and that are electrically isolated from one another. Provision is made for the strip testing to be performed without mounting the encapsulated integrated circuit dies on a support tape.
Claims13
A method of processing integrated circuit dies, comprising:
- providing a plurality of integrated circuit dies mounted on a leadframe strip, electrically connected to the leadframe strip, and encapsulated together with the leadframe strip in an encapsulant;
- making first cuts into said encapsulant, wherein said encapsulated integrated circuit dies remain encapsulated together within said encapsulant after completion of said first cuts and said leadframe strip to electrically isolate the encapsulated integrated circuit dies from one another;
- performing strip testing on the encapsulated integrated circuit dies without mounting the encapsulated integrated circuit dies on a support tape, including making second cuts through said encapsulant with the encapsulated integrated circuit dies supported on a fixture having a protruding portion that is received in said first cuts while said second cuts are made, wherein said second cuts are aligned with said first cuts and separate the encapsulated integrated circuit dies from one another.
A method of processing integrated circuit dies, comprising:
- providing a plurality of encapsulated integrated circuit dies that are electrically isolated from one another, and that each have a set of leads connected thereto and accessible externally thereof;
- and
- performing strip testing on the encapsulated integrated circuit dies with the encapsulated integrated circuit dies encapsulated together within an encapsulant without mounting the encapsulated integrated circuit dies on a support tape;
- and
- making cuts through said encapsulant to separate the encapsulated integrated circuit dies from one another with said encapsulated integrated circuit dies supported on a fixture having a protruding portion received within a portion of said encapsulant.
2 more elements
Dependencies are inferred from the claim text.