Imprinting method and imprinting apparatus

An imprinting method for transferring a pattern of a mold to a resin dispensed on a substrate by using an imprinting apparatus including a holding unit configured to hold the mold, a dispensing unit configured to dispense the resin on the substrate and a selection unit that selects n shot areas on the substrate, the method comprising:

• dispensing the resin in the n selected shot areas arranged in a direction parallel to a direction in which the holding unit and the dispensing unit are arranged where n is an integer equal to or greater than 2;
• and
• after the dispensing the resin in the n selected shot areas is performed, transferring the pattern to the n selected shot areas on a one-by-one basis,
• wherein in the dispensing the resin, while the substrate is being moved in a direction from the dispensing unit toward the holding unit, the resin is continuously dispensed in the n selected shot areas arranged on the substrate in a row in a direction from the holding unit toward the dispensing unit in order in the direction from the holding unit toward the dispensing unit, and the pattern is continuously transferred to the n selected shot areas in order in which the resin is dispensed in the n selected shot areas,
• wherein a distance D between the dispensing unit and the mold and a width W of each shot area as seen in the direction parallel to the direction in which the holding unit and the dispensing unit are arranged are selected so as to satisfy a condition D>(3/2−1/n)W,
• wherein the dispensing and the transferring are performed repeatedly on the substrate,
• wherein the selection unit determines n that satisfies the condition D>(3/2−1/n)W based on the distance D and the width W, and selects n shot areas from a plurality of shot areas on a wafer based on the determined n, and
• wherein one shot area on the substrate corresponds to a pattern area formed on the mold,
• wherein the selection unit is configured to select the n shot areas such that each two adjacent shot areas of the n shot areas selected are at locations separated apart by a predetermined distance, and wherein the predetermined distance between the two adjacent shot areas of the n shot areas selected is larger than a width of the shot area.

An imprinting method for transferring a pattern of a mold to a resin dispensed on a substrate by using an imprinting apparatus including a holding unit configured to hold the mold, a dispensing unit configured to dispense the resin on the substrate and a selection unit that selects n shot areas on the substrate, the method comprising:

• dispensing the resin in the n selected shot areas arranged in a direction parallel to a direction in which the holding unit and the dispensing unit are arranged where n is an integer equal to or greater than 2;
• and
• after the dispensing the resin in the n selected shot areas is performed, transferring the pattern to the n selected shot areas on a one-by-one basis;
• wherein in the dispensing the resin, while the substrate is being moved in a direction from the holding unit toward the dispensing unit, the resin is continuously dispensed in the n selected shot areas arranged on the substrate in a row in a direction from the holding unit toward the dispensing unit in order in the direction from the dispensing unit toward the holding unit, and the pattern is continuously transferred to the n selected shot areas in order in which the resin is dispensed in the n selected shot areas,
• wherein a distance D between the dispensing unit and the mold and a width W of each shot area as seen in the direction parallel to the direction in which the holding unit and the dispensing unit are arranged are selected so as to satisfy a condition D>W/2,
• and wherein the dispensing and the transferring are performed repeatedly on the substrate,
• wherein the selection unit determines n when the distance D and the width W satisfy the condition D>W/2, and selects n shot areas from a plurality of shot areas on a wafer based on the determined n, and
• wherein one shot area on the substrate corresponds to a pattern area formed on the mold.