Back to results
US 8,571,249 B2Granted
Silicon microphone package
AssigneeGeneral Mems Corporation
InventorYunlong Wang
Life of this patent
Estimating the term…
Abstract
A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.
Claims25
A silicon microphone package, comprising:
- an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element;
- a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween;
- and
- a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die.
1 more element
A silicon microphone package, comprising:
- an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die, a cavity, and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element;
- a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween;
- an acoustic opening formed in a portion of the first cover member, partially exposing the integrated microphone die;
- and
- a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die, and wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die.
2 more elements
A silicon microphone package, comprising:
- an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die, a cavity, and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element;
- a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween;
- a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die;
- and
- an acoustic opening formed in a portion of the second cover member, partially exposing the integrated microphone die, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die.
2 more elements
Dependencies are inferred from the claim text.