Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate

A resin substrate comprising:

• a resin layer including an in-plane electrode in a bottom surface thereof;
• a light reflective conductor provided on the in-plane electrode and having a smooth surface defined by a top surface covered with the resin layer, the smooth surface of the light reflective conductor having a curved convex shape;
• and
• an interlayer connection conductor defined by a hole for an interlayer connection conductor that extends from a top surface of the resin layer to the light reflective conductor and that is covered or filled with a conductive material;
• wherein
• the light reflective conductor is made of a cream solder that has been applied on the in-plane electrode, melted, and hardened;
• and
• the light reflective conductor is provided on a portion of the in-plane electrode adjacent to or aligned with the hole in the resin layer but not on other portions of the in-plane electrode.

A component-incorporated substrate comprising:

• a core substrate including an in-plane electrode in a top surface thereof;
• a mount component mounted on the in-plane electrode via a mounting conductor;
• a light reflective conductor provided in a region different from a mounting region of the mount component on the in-plane electrode, and having a smooth surface defined by a top surface, the smooth surface of the light reflective conductor having a curved convex shape;
• a resin layer arranged on the core substrate so as to cover the mounting conductor, the mount component and the light reflective conductor;
• and
• an interlayer connection conductor defined by a hole for an interlayer connection conductor that extends from a top surface of the resin layer to the light reflective conductor and that is covered or filled with a conductive material;
• wherein
• the light reflective conductor is made of a cream solder that has been applied on the in-plane electrode, melted, and hardened;
• and
• the light reflective conductor is provided on a portion of the in-plane electrode adjacent to or aligned with the hole in the resin layer but not on other portions of the in-plane electrode.

A component-incorporated substrate comprising:

• a resin layer including an in-plane electrode in a bottom surface thereof;
• a mount component mounted on the in-plane electrode via a mounting conductor, and including a periphery covered with the resin layer;
• a light reflective conductor provided in a region different from a mounting region of the mount component on the in-plane electrode, and including a smooth surface defined by a top surface covered with the resin layer, the smooth surface of the light reflective conductor having a curved convex shape;
• and
• an interlayer connection conductor extending from a top surface of the resin layer to the light reflective conductor;
• wherein
• the light reflective conductor is made of a cream solder that has been applied on the in-plane electrode, melted, and hardened;
• and
• the light reflective conductor is provided on a portion of the in-plane electrode adjacent to or aligned with the hole in the resin layer but not on other portions of the in-plane electrode.