Planar electrical power electronic modules for high-temperature applications, and corresponding production methods
AssigneeSiemens Aktiengesellschaft
InventorsFriedrich Lupp, Karl Weidner
Life of this patent
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Abstract
With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material and at least one opening (5) in which at least one electrical contact-connection (7) of the component (1) to outside the component (1) is provided. This makes it possible to provide electronic components (1), in particular power modules, for a temperature range of >175 DEG C.
Claims12
An electronic component of a module, wherein the component is attached to an electrically-insulating carrier film comprising at least one first inorganic material, which has at least one opening in which at least one electrical contact-connection of the component to the outside is provided, wherein the at least one first inorganic material comprises exclusively inorganic or multi-bonded inorganic insulation materials.
An electronic component of a module including a plurality of insulating materials, wherein the component is attached to an electrically-insulating carrier film which has at least one opening in which at least one electrical contact-connection of the component to the outside is provided,
- a fill layer comprising electrical insulation of the electronic components by means of a high-temperature package, with the fill layer filling spaces between the electronic component, carrier film and a leadframe,
- wherein the plurality of insulating materials comprise exclusively inorganic or multi-bonded inorganic insulation materials.
Dependencies are inferred from the claim text.