Wafer for magnetic head and method for manufacturing the same
AssigneeTDK Corporation
InventorsKatsuya Kanakubo, Kenji Senga
Life of this patent
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AssigneeTDK Corporation
InventorsKatsuya Kanakubo, Kenji Senga
Estimating the term…
A wafer for a magnetic head includes a magnetic pole which has a design capable of avoiding pole missing due to processing with an improved resistance to the processing during a magnetic pole forming process. Each magnetic head element provided in the wafer has a recording magnetic pole film. The magnetic pole film has a large width part, a small width part and a support part. The small width part projects continuously from the large width part and extends with a constant width W1, while the support part is continuous with an end of the small width part and has a width W2. The width W1 and the width W2 satisfy the relationship of 1<W2/W1<2.
A wafer for a magnetic head comprising a plurality of magnetic head elements, each magnetic head element having a recording magnetic pole film, the magnetic pole film having a large width part, a small width part and a support part, the small width part projecting from the large width part and extending with a constant width W1, the support part being continuous with an end of the small width part and having a width W2 which is larger than the width W1 of the small width part, the width W1 of the small width part and the width W2 of the end satisfying the relationship of 1<W2/W1<2.
A method for manufacturing a wafer for a magnetic head having a plurality of magnetic head elements, comprising the step of forming a recording magnetic pole film having a large width part, a small width part and a support part, the small width part projecting continuously from the large width part and extending with a constant width W1, the support part being continuous with an end of the small width part and having a width W2 which is larger than the width W1 of the small width part, the width W1 of the small width part and the width W2 of the end satisfying the relationship of 1<W2/W1<2.
Dependencies are inferred from the claim text.