Apparatus providing thermal management for radio frequency devices
AssigneeQUALCOMM Incorporated
InventorEric Stephen Mattis
Life of this patent
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Abstract
Apparatus providing thermal management for radio frequency devices. An antenna is provided that includes an antenna body configured for transmitting electrical signals, and one or more mounting surfaces coupled to the antenna body, the one or more mounting surfaces configured for mounting to a device surface so that a resulting thermal resistance (Rth) between the device surface and the antenna body is less than 15 degrees centigrade per watt. The antenna body forms one of a PIFA antenna, whip antenna, patch antenna, or a meandered patch antenna.
Claims20
An antenna for thermal management in a device, the antenna comprising:
- an antenna body configured for transmitting electrical signals;
- one or more mounting surfaces coupled to the antenna body, the one or more mounting surfaces configured for mounting to a device surface, the one or more mounting surfaces sized to provide a thermal resistance (Rth) between the device surface and the antenna body that is less than 15 degrees centigrade per watt;
- and
- thermally conductive material coupled between the one or more mounting surfaces and the device surface to facilitate heat transfer.
An antenna apparatus for thermal management in a device, the apparatus comprising:
- an antenna body means for transmitting electrical signals;
- mounting means coupled to the antenna body means, the mounting means for mounting to a device surface, the mounting means sized to provide a thermal resistance between the device surface and the antenna body means that is less than 15 degrees centigrade per watt;
- and
- means for thermal conductivity coupled between the mounting means and the device surface to facilitate heat transfer.
A device comprising:
- a power amplifier (PA);
- an antenna body configured for transmitting electrical signals from the power amplifier;
- one or more mounting surfaces coupled to the antenna body, the one or more mounting surfaces configured for mounting to a device surface, the one or more mounting surfaces sized to provide a thermal resistance (Rth) between the device surface and the antenna body that is less than 15 degrees centigrade per watt;
- and
- thermally conductive material coupled between the one or more mounting surfaces and the device surface to facilitate heat transfer.
Dependencies are inferred from the claim text.