Radio frequency tag and method of manufacturing the same
AssigneeFujitsu Limited
InventorsManabu Kai, Toru Maniwa, Takashi Yamagajo
Life of this patent
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Abstract
A metal-resistant radio frequency tag that has a broader band pass band (frequency versus communication range) characteristic compared to conventional techniques is achieved. For this purpose, the radio frequency tag according to the present invention includes a first resonator pattern, the first resonator pattern including a chip connecting section to which a chip is to be connected, and an inductance section that is capable of adjusting an impedance matching with the chip; and a second resonator pattern that is fed through electromagnetic induction coupling via the inductance section.
Claims21
A radio frequency tag comprising:
- a first resonator pattern, the first resonator pattern comprising a chip connecting section to which a chip is to be connected, and an inductance section that is capable of adjusting an impedance matching with the chip;
- and
- a second resonator pattern that is fed through electromagnetic induction coupling via the inductance section wherein,
- the first and second resonator patterns are arranged in one of the faces of a dielectric substrate such that the inductance section performs as a power source to the second resonator pattern.
A method of manufacturing a radio frequency tag, the method comprising:
- forming a first resonator pattern and a second resonator pattern that is fed through electromagnetic induction coupling via an inductance section on a sheet-like member that can cover three faces of four faces defining the surrounding edge length in the longitudinal direction of a dielectric substrate in a region corresponding to one side and side faces of the dielectric substrate, the three faces are faces other than one of the side faces of the dielectric substrate opposing to the longitudinal direction, the first resonator pattern comprising a chip connecting section to which a chip is to be connected and the inductance section that is capable of adjusting an impedance matching with the chip;
- forming a conductor pattern that electrically communicates with each of the resonator patterns in a region corresponding to the other face of the dielectric substrate of the sheet-like member;
- and
- securing the sheet-like member to the dielectric substrate by wrapping the dielectric substrate with the sheet-like member such that the first and second resonator patterns are arranged on one side of the dielectric substrate whereas the conductor pattern is arranged on the other face of the dielectric substrate.
Dependencies are inferred from the claim text.