Semiconductor inspection apparatus, semiconductor wafer positioning method, and semiconductor wafer inspection method

A semiconductor inspection apparatus, comprising:

• a plurality of wafer stages, provided independently for each of a plurality of laminated semiconductor wafers, that directly or indirectly secure said corresponding semiconductor wafers and that possess a mechanism for positioning said corresponding semiconductor wafers;
• a probe card, arranged outside or in between said plurality of laminated semiconductor wafers so as to face said semiconductor wafers, that transmits a signal or power to said plurality of semiconductor wafers;
• wherein
• said semiconductor wafer has a wafer electrode electrically connected to each of subject chips in a region where said subject chip is not disposed;
• a sheet having a sheet electrode that contacts said wafer electrode at a position where said sheet electrode faces said wafer electrode;
• and
• a pressing member that presses said wafer electrode of said semiconductor wafer, which is furthest from said base and said sheet electrode contacting said wafer electrode of said semiconductor wafer furthest from said base to the side of said base.

A semiconductor wafer inspection method, comprising:

• (a) positioning a plurality of semiconductor wafers laminated with each other and secured by each of a plurality of wafer stages independently capable of positioning and a probe card provided outside or in between said plurality of semiconductor wafers so as to face said semiconductor wafers for each of the semiconductor wafers termed as “step (a)”;
• (b) having said probe card simultaneously transmit an inspection signal to subject chips provided in each of said semiconductor wafers (termed as “step (b)”);
• and
• (c) having each of said subject chips that have received said inspection signal simultaneously transmit the respective inspection result to said probe card (termed as “step (c)”);
• wherein
• a plurality of subject chips are formed in said semiconductor wafers;
• said probe card comprises one or more inspecting chips capable of performing non-contact transmission to said subject chips in said semiconductor wafers;
• said subject chip includes at least one non-contact transmission electrode that performs non-contact transmission of a signal or power;
• and
• said inspecting chip includes at least one non-contact transmission electrode that performs non-contact transmission of a signal or power to said non-contact transmission electrode of said subject chip;
• and
• said step (b) and said step (c) are performed with non-contact transmission between an inspecting chip provided in said probe card and said subject chips.