Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation
AssigneeSTATS ChipPAC, Ltd.
InventorsHenry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho, Philip Lyndon Cablao, Jose Alvin Caparas
Life of this patent
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Abstract
An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.
Claims20
A method for manufacturing an integrated circuit package system comprising:
- providing a die-pad partitioned to a side pad and a die attach pad having an edge with a predefined slot collinear with the edge;
- attaching an integrated circuit to the die-pad;
- connecting the integrated circuit to the die-pad with a bond wire;
- encapsulating the integrated circuit and the bond wire with an encapsulation;
- and
- forming partial saw isolation grooves along a single axis of the encapsulation, the partial saw isolation grooves overlapping the predefined slot and separating the side pad from the die attach pad.
A method for manufacturing an integrated circuit package system comprising:
- providing a lead-frame with a die-pad partitioned to a side pad and a die attach pad having an edge, die attach paddle bars, and a predefined slot collinear with the edge;
- attaching an integrated circuit to the die-pad;
- connecting the integrated circuit to the die-pad with a bond wire;
- connecting the die-pad with an elevated lead-frame element;
- encapsulating the integrated circuit and the bond wire with an encapsulation;
- and
- forming partial saw isolation grooves along a single axis of the encapsulation, the partial saw isolation grooves overlapping the predefined slot and separating the side pad from the die attach pad.
An integrated circuit package system comprising:
- a side pad;
- a die attach pad adjacent to the side pad, the die attach pad having an edge;
- a predefined slot collinear to the edge of the die attach pad;
- an integrated circuit attached to the die attach pad;
- a bond wire connected to the integrated circuit and to the die attach pad;
- an encapsulation encapsulating the integrated circuit and the bond wire;
- and
- partial saw isolation grooves along a single axis of the encapsulation, the partial saw isolation grooves overlapping the predefined slot.
Dependencies are inferred from the claim text.