Integrated circuit packaging system with encapsulation and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsHyungSang Park, A Leam Choi, JoHyun Bae
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a rounded interconnect on the package carrier; mounting a conductive shield over the package carrier, the conductive shield having an elevated portion and a hole adjacent to the elevated portion with the elevated portion over the integrated circuit and the rounded interconnect exposed from the hole; and forming an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- mounting an integrated circuit over a package carrier;
- mounting a rounded interconnect on the package carrier;
- mounting a conductive shield over the package carrier, the conductive shield having an elevated portion and a perimeter portion below the elevated portion, the perimeter portion having a hole, wherein the rounded interconnect is mounted within the hole, and wherein the hole exposes the rounded interconnect from the conductive shield;
- and
- forming an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed from the encapsulation.
A method of manufacture of an integrated circuit packaging system comprising:
- mounting an integrated circuit over a package carrier;
- mounting a rounded interconnect on the package carrier;
- attaching an adhesive to the integrated circuit;
- mounting a conductive shield over the package carrier, the conductive shield having an elevated portion and a perimeter portion below the elevated portion, the elevated portion attached to the adhesive, the perimeter portion having a hole, wherein the rounded interconnect is mounted within the hole, and wherein the hole exposes the rounded interconnect from the conductive shield;
- and
- forming an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed from the encapsulation.
An integrated circuit packaging system comprising
- a package carrier;
- an integrated circuit over the package carrier;
- a rounded interconnect on the package carrier;
- a conductive shield over the package carrier, the conductive shield having an elevated portion and a perimeter portion below the elevated portion, the perimeter portion having a hole, the rounded interconnect within the hole, and wherein the hole exposes the rounded interconnect from the conductive shield;
- and
- an encapsulation between the conductive shield and the package carrier with the rounded interconnect exposed from the encapsulation.
Dependencies are inferred from the claim text.