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US 8,569,781 B2Granted
LED package with light-absorbing layer
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsPi-Chiang Hu, Shih-Yuan Hsu, Kai-Lun Wang
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Abstract
An LED package comprises a substrate, a reflector, a light-absorbing layer, an encapsulation layer and an LED chip. The light-absorbing layer is located around the reflector and is able to absorb any light which penetrates through the reflector. Therefore, any vignetting or halation of light from the LED package is prevented. Moreover, the LED package can be constructed on a very small scale with no reduction in its color rendering properties.
Claims20
An LED package, comprising:
- a substrate, having two electrodes located thereon;
- an LED chip, disposed on the substrate and, respectively, electrically connecting to the two electrodes;
- a reflector, defining a depression located on the substrate, wherein the LED chip is disposed inside the depression;
- a light-absorbing layer, located on the substrate around the reflector, the light-absorbing layer being a paste;
- and
- an encapsulation layer, located inside the depression, covering the LED chip.
3 more elements
An LED package, comprising:
- a substrate, having a reflector defining a depression and two electrodes located on a top surface of the substrate;
- an LED chip, disposed inside the depression and, respectively, electrically connecting to the two electrodes;
- a light-absorbing layer, located on the substrate around the reflector, the light-absorbing layer being a paste;
- and
- an encapsulation layer, located inside the depression, covering the LED chip.
2 more elements
Dependencies are inferred from the claim text.