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US 8,569,771 B2Granted
LED module with an LED semiconductor chip mounted on a silicon platform
AssigneeLexedis Lighting GmbH
InventorsStefan Tasch, Nick Shepherd
Life of this patent
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Abstract
An LED module having an LED semiconductor chip mounted directly or indirectly on a platform. The platform is made from silicon and extends laterally beyond the LED semiconductor chip having an active light emitting layer and a substrate. At least one electronic component that is part of the control circuitry for the LED semiconductor chip is integrated in the silicon platform.
Claims17
An LED module, comprising:
- an LED semiconductor chip mounted directly or indirectly on a platform, the platform being made from silicon and extending laterally beyond the LED semiconductor chip, wherein:
- the LED semiconductor chip comprises an active light emitting layer and a substrate,
- the silicon platform includes a base part and a reflector and the reflector comprises at least one intermediate layer,
- at least one electronic component that is part of a control circuitry for the LED semiconductor chip integrated in said intermediate layer,
- walls of the silicon platform define a depression and extend vertically beyond the active light emitting layer of the LED semiconductor chip,
- the integrated electronic component is at least one of a wireless communication device and a sensor for at least one of light intensity, color temperature, and temperature, and
- the LED chip is mounted on a bottom surface of said intermediate layer.
4 more elements
An LED module, comprising:
- an LED semiconductor chip mounted directly or indirectly on a platform, the platform being made from silicon and extending laterally beyond the LED semiconductor chip, wherein:
- the LED semiconductor chip comprises an active light emitting layer and a substrate,
- the silicon platform comprises a base part and a reflector and the base part comprises at least a lower layer and an upper layer,
- at least one electronic component that is part of a control circuitry for the LED semiconductor chip integrated in said lower layer,
- walls of the silicon platform define a depression and extend vertically beyond the active light emitting layer of the LED semiconductor chip, and
- the integrated electronic component is at least one of a wireless communication device and a sensor for at least one of light intensity, color temperature, and temperature.
3 more elements
Dependencies are inferred from the claim text.