Heat treatment apparatus
AssigneeHitachi High-Technologies Corporation
InventorsMasatoshi Miyake, Ken'etsu Yokogawa
Life of this patent
Estimating the term…
Loading patent…
AssigneeHitachi High-Technologies Corporation
InventorsMasatoshi Miyake, Ken'etsu Yokogawa
Estimating the term…
Provided is a heat treatment apparatus in which a heat treatment apparatus in which the thermal efficiency is high, the maintenance expense is low, the throughput is high, the surface roughness of a sample can be reduced, and the discharge uniformity is excellent, although the heat treatment is performed at 1200 ° C. or more. A heat treatment apparatus includes: parallel planar electrodes; a radio-frequency power supply generating plasma by applying radio-frequency power between the parallel planar electrodes; a temperature measuring section measuring the temperature of a heated sample; and a control unit controlling an output of the radio-frequency power supply, wherein at least one of the parallel planar electrodes has a space where the heated sample is installed, therein, and heats the sample in the electrode by the plasma generated between the parallel planar electrodes.
A heat treatment apparatus, comprising:
The heat treatment apparatus, comprising:
Dependencies are inferred from the claim text.