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US 8,569,633 B2Granted
Feedthrough for microelectromechanical system
AssigneeMedtronic, Inc.
InventorsRogier Receveur, Michael A. Schugt, William J. Taylor, Brad C. Tischendorf
Life of this patent
Estimating the term…
Abstract
A hermetically sealed microelectromechanical system (MEMS) package for an implantable medical device is presented. The MEMS comprises a first substrate that includes an aperture. A feedthrough assembly is coupled to the aperture, the feedthrough assembly comprises a conductive element housed in a glass insulator member. A second substrate is coupled to the first substrate.
Claims26
A micro electromechanical system (MEMS) package for an implantable medical device comprising:
- a first substrate that includes a first surface, a second surface, and an aperture extending through the first substrate from the first surface to the second surface;
- a feedthrough assembly coupled to the aperture, the feedthrough assembly including a conductive element housed in a glass insulator member;
- a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, further wherein the first substrate is coupled to the second substrate by joint material disposed on the first surface of the second substrate contacting the second surface of the first substrate, further wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device;
- and
- a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate.
2 more elements
A micro electromechanical system (MEMS) package for an implantable medical device comprising:
- a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface;
- a feedthrough assembly comprising a ceramic insulator and a conductive element housed in the ceramic insulator member, the feedthrough assembly disposed in the aperture;
- a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device,
- a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate;
- and
- wherein no conductive material exists between the conductive element and the first substrate.
3 more elements
A microelectromechanical system (MEMS) package for an implantable medical device comprising:
- a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface;
- a feedthrough assembly hermetically sealed in the aperture, the feedthrough assembly being exposed on an exterior surface of the first substrate, and wherein the feedthrough assembly includes:
- a glass insulator member sealed within the aperture;
- and
- a conductive pin extending through the insulator member;
- a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device;
- a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate;
- and
- wherein no conductive material exists between the conductive element and the first substrate.
6 more elements
A MEMS package for an implantable medical device comprising:
- a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface;
- a feedthrough assembly hermetically sealed in the aperture comprising:
- a glass insulator member sealed within the aperture;
- and
- a conductive pin extending through glass insulator member;
- a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, further wherein the first is coupled to the second substrate by joint material located between the second surface of the first substrate and the first surface of the second substrate, further wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device;
- a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate;
- and
- wherein no conductive material exists between the conductive element and the first substrate.
6 more elements
A microelectromechanical system (MEMS) package for an implantable medical device comprising:
- a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface;
- a feedthrough assembly hermetically sealed in the aperture comprising:
- a glass insulator member sealed within the aperture;
- and
- a conductive pin extending through glass insulator member;
- a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate by joint material located between the second surface of the first substrate and the first surface of the second substrate such that the first surface of the second substrate faces the second surface of the first substrate, wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device;
- a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate;
- and
- wherein no conductive material exists between the conductive element and the first substrate.
6 more elements
A microelectromechanical system (MEMS) package for an implantable medical device comprising:
- a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface;
- a feedthrough assembly hermetically sealed in the aperture, the feedthrough assembly being exposed on the second surface of the first substrate, and wherein the feedthrough assembly includes:
- a glass insulator member sealed within the aperture;
- and
- a conductive pin extending through the insulator member;
- a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, further wherein the first substrate is coupled to the second substrate by joint material located between the second surface of the first substrate and the first surface of the second substrate, further wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device;
- a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate;
- and
- wherein no conductive ferrule exists between the conductive element and the first substrate.
6 more elements
A MEMS package for an implantable medical device comprising:
- a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface;
- a feedthrough assembly hermetically sealed in the aperture, the feedthrough assembly including a conductive element housed solely in a glass insulator member;
- a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate, further wherein the first substrate is coupled to the second substrate by joint material located between the second surface of the first substrate and the first surface of the second substrate, further wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device;
- a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate;
- wherein the first substrate comprises glass, and
- wherein no conductive material exists between the conductive element and the first substrate.
3 more elements
A MEMS package for an implantable medical device comprising:
- a first substrate that includes a first exterior surface, a second surface, and an aperture extending through the first substrate from the first exterior surface to the second surface;
- a feedthrough assembly hermetically sealed in the aperture, the feedthrough assembly including a conductive element housed solely in a glass insulator member;
- and
- a second substrate comprising a first surface and a second surface, wherein the second substrate is coupled to the first substrate such that the first surface of the second substrate faces the second surface of the first substrate,
- wherein the first substrate is located adjacent the first surface of the second substrate but not the second surface of the second substrate such that the second surface of the second substrate is configured for positioning directly adjacent to a housing of an implantable medical device;
- a metallized trace disposed on the first surface of the second substrate, wherein the conductive element is directly coupled to the metallized trace to electrically couple the conductive element to the second substrate;
- and
- wherein the first substrate comprises glass, and
- wherein no conductive ferrule exists between the conductive element and the first substrate.
6 more elements
Dependencies are inferred from the claim text.