Flex-rigid wiring board and method for manufacturing the same

A method for manufacturing a flex-rigid wiring board, comprising:

• preparing a flexible wiring board having a conductive pattern;
• preparing a first insulation layer having a first hole and a first conductor structure comprising a filled conductor formed by filing a plating in the first hole;
• preparing a second insulation layer having a second hole and a second conductor structure comprising a filled conductor formed by filling a plating in the second hole;
• preparing a third insulation layer having a third hole and a third conductor structure comprising a filled conductor formed by filling a plating in the third hole;
• forming a laminated body comprising the flexible wiring board, the first insulation layer, the second insulation layer and the third insulation such that the flexible wiring board and the first insulation layer are positioned side by side and the second insulation layer and the third insulation layer are sandwiching the first insulation layer and an end portion of the flexible wiring board and that the first conductor structure, the second conductor structure and the third conductor structure are positioned along an axis;
• and
• pressing and heating the laminated body such that the first conductor structure, the second conductor structure and the third conductor structure are set to be electrically continuous with each other,
• wherein the forming of the laminated body comprises forming a conductive pattern on the second insulation layer and forming a connection conductor through the second insulation layer such that the connection conductor is directly connected to the conductive pattern on the flexible wiring board and that the connection conductor connects the conductive pattern on the second insulation layer and the conductive pattern on the flexible wiring board.