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US 8,569,404 B2Granted
Polyamide resin composition and molded article
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsShun Ogawa, Takahiko Sumino
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Abstract
Disclose is a polyamide resin composition having excellent heat resistance, heat aging resistance and mechanical physical properties, which is produced by incorporating a specified aromatic secondary amine compound and a specified organic sulfur based compound into a polyamide composed of a diamine unit containing a paraxylylenediamine unit as a major component and a dicarboxylic acid unit containing a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms as a major component.
Claims20
A polyamide resin composition, comprising:
- (A) a polyamide comprising (a1) a diamine unit comprising 70% by mole or more of (a1i) a paraxylylenediamine unit and (a2) a dicarboxylic acid unit comprising 70% by mole or more of (a2i) a linear aliphatic dicarboxylic acid unit comprising from 6 to 18 carbon atoms;
- (B) an aromatic secondary amine compound;
- and
- (C) an organic sulfur comprising compound,
- wherein the polyamide resin composition comprises from 0.05 to 5 parts by mass of the aromatic secondary amine compound (B) and from 0.05 to 5 parts by mass of the organic sulfur based compound (C) based on 100 parts by mass of the polyamide (A).
2 more elements
Dependencies are inferred from the claim text.