Using spectra to determine polishing endpoints
AssigneeApplied Materials, Inc.
InventorsHarry Q. Lee, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David
Life of this patent
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Abstract
Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described.
Claims4
A non-transitory computer readable storage medium comprising a computer program product that is operable to cause a data processing apparatus to perform operations comprising:
- receiving a first spectrum measured from a substrate undergoing polishing during a first scan of an optical monitoring module across the substrate;
- comparing the first spectrum to at least some of a plurality of reference spectra in a library to determine a best matching first matching spectrum from the at least some of the plurality of reference spectra, each reference spectrum of the plurality of reference spectra in the library having an associated index number;
- determining a first index number for the first matching spectrum, wherein the first index number is N;
- receiving a second spectrum measured from the substrate undergoing polishing during a subsequent second scan of the optical monitoring module across the substrate, wherein the second scan is X scans after the first scan;
- comparing the second spectrum to a subset of the plurality of reference spectra in the library to determine a best matching second matching spectrum from the subset, the subset including at least two spectra and less than all of the reference spectra in the library, wherein Y degrees of freedom is a predetermined number and the subset of the plurality of reference spectra in the library are reference spectra having index numbers within (N+X)±Y;
- and
- determining a second index number for the second matching spectrum.
A method of determining a polishing endpoint comprising:
- obtaining a spectrum measured from a substrate undergoing polishing during a scan of an optical monitoring module across the substrate;
- determining a number N of platen rotations at which the scan of the optical monitoring module across the substrate is performed;
- comparing the spectrum to a subset of a plurality of reference spectra in a library to determine a best matching spectrum from the subset, each reference spectrum of the plurality of reference spectra in the library having an index number, the subset including at least two spectra and less than all of the reference spectra in the library, wherein Y degrees of freedom is a predetermined number and the subset of the plurality of reference spectra in the library are reference spectra having index numbers within N±Y;
- and
- determining an index number for the best matching spectrum.
A non-transitory computer readable storage medium comprising a computer program product that is operable to cause a data processing apparatus to perform operations comprising:
- receiving a spectrum measured from a substrate undergoing polishing during a scan of an optical monitoring module across the substrate;
- determining a number N of platen rotations at which the scan of the optical monitoring module across the substrate is performed;
- comparing the spectrum to a subset of a plurality of reference spectra in a library to determine a best matching spectrum from the subset, each reference spectrum of the plurality of reference spectra in the library having an index number, the subset including at least two spectra and less than all of the reference spectra in the library, wherein Y degrees of freedom is a predetermined number and the subset of the plurality of reference spectra in the library are reference spectra having index numbers within N±Y;
- and
- determining an index number for the best matching spectrum.
A method of determining a polishing endpoint comprising:
- receiving a first spectrum measured from a substrate undergoing polishing during a first scan of an optical monitoring module across the substrate;
- comparing the first spectrum to at least some of a plurality of reference spectra in a library to determine a best matching first matching spectrum from the at least some of the plurality of reference spectra, each reference spectrum of the plurality of reference spectra in the library having an associated index number;
- determining a first index number for the first matching spectrum, wherein the first index number is N;
- receiving a second spectrum measured from the substrate undergoing polishing during a subsequent second scan of the optical monitoring module across the substrate, wherein the second scan is X scans after the first scan;
- comparing the second spectrum to a subset of the plurality of reference spectra in the library to determine a best matching second matching spectrum from the subset, the subset including at least two spectra and less than all of the reference spectra in the library, wherein Y degrees of freedom is a predetermined number and the subset of the plurality of reference spectra in the library are reference spectra having index numbers within (N+X)±Y;
- and
- determining a second index number for the second matching spectrum.
Dependencies are inferred from the claim text.