Pre-bonded substrate for integrated circuit package and method of making the same

A method of manufacturing an integrated circuit package, comprising the steps of:

• a) providing a substrate comprising the steps of:
• i patterning a leadframe on a first side forming a plurality of lands and a first recessed portion between said plurality of lands;
• ii disposing a first bonding compound on said first side leadframe, said first bonding compound having a first portion filling said first recessed portion;
• iii patterning said leadframe on an opposing second side forming a plurality of electrically isolated routing leads and a second recessed portion between said plurality of routing leads;
• and
• iv disposing a plurality of bonding pads on said plurality of routing leads;
• whereby said first bonding compound prevents displacement of said plurality of routing leads;
• b) attaching at least one semiconductor die onto said second side of said substrate;
• c) electrically connecting said semiconductor die to said plurality of bonding pads through bonding wires;
• and
• d) encapsulating said semiconductor die, said bonding wires and said substrate on said second side.

A method of manufacturing a substrate for an integrated circuit package, comprising the steps of:

• a) patterning a leadframe on a first side forming a plurality of lands, a first recessed portion between said plurality of lands, and a support ring surrounding each individual unit in said leadframe;
• b) disposing a first bonding compound on said first side of said leadframe, said first bonding compound having a first portion filling said first recessed portion;
• c) patterning said leadframe on an opposing second side forming a plurality of routing leads, a second recessed portion between said plurality of routing leads, at least one said routing lead comprising a tie bar connecting said routing lead to said support ring;
• d) disposing a second bonding compound on said second side of said leadframe filling at least a portion of said second recessed portion;
• and
• e) disposing a plurality of bonding pads on said plurality of routing leads;
• whereby said first bonding compound and said tie bar prevents displacement of said plurality of routing leads;
• and combination of said first bonding material and said second bonding material hold metal features in place during assembly processes of die attach, die to substrate interconnection and encapsulation molding.