Method for packaging light emitting diode

A method for packaging a light emitting diode comprising:

• providing a flexible substrate having a thickness in a range from 50 to 150 microns whereby the substrate is flexible, the flexible substrate comprising a heat-conducting layer, an insulating layer located on the heat-conducting layer and an electrically conductive layer positioned on the insulating layer;
• etching the conductive layer to form a gap and expose a part of the insulating layer, the conductive layer being divided by the gap into a first electrode and a second electrode isolated from each other;
• pressing the flexible substrate with a mold to form a recess in the substrate, wherein neighboring parts of the first electrode and the second electrode are pressed to be thinner and longer, and the gap is located below the recess;
• positioning a light emitting element in the recess, the light emitting element being located on the conductive layer and electrically connected to the first and second electrodes of the conductive layer;
• and
• forming an encapsulation in the recess to cover the light emitting element.