Positive photosensitive resin composition

A positive photosensitive resin composition, comprising:

• (A) a polyamic acid or polyamic acid ester compound including a repeating unit represented by the following Formula 1;
• (B) a photosensitive diazoquinone compound;
• (C) a silane compound;
• (D) a phenol compound;
• and
• (E) a solvent,
• wherein in the above Formula 1,
• Ra, Rb, Rc, Rd, Re, and Rf are the same or different and are independently hydrogen or a monovalent organic group,
• R1 and R2 are the same or different and are independently a single bond or substituted or unsubstituted alkylene,
• a′, b′, c′, d′, e′, and f′ are the same or different and are independently 0 or 1, a′+b′+c′ and d′+e′+f are integers of 2 or 3, respectively,
• Y1 and Y2 are the same or different and are independently a substituted or unsubstituted alicyclic organic group, derived from one of the compounds represented by the following Chemical Formulae 6 or 8:
• wherein in the above Formula 8,
• A2 is O, CR14R15, CO, CONH, S, or SO2, wherein R14 and R15 are the same or different and are independently substituted or unsubstituted alkyl, hydrogen, or fluoroalkyl,
• X1 is substituted or unsubstituted arylene, substituted or unsubstituted alkylene, or substituted or unsubstituted cycloalkylene,
• X2 is a divalent to a quadrivalent aromatic or aliphatic organic group, or is a functional group represented by the following Formula 2,
• m1 and m2 are mole ratios,
• m1+m2=100 mol %,
• m1 ranges from 60 to 100 mol %, and
• m2 ranges from 0 to 40 mol %:
• wherein in the above Formula 2,
• R3, R4, R′3 and R′4 are the same or different and are independently substituted or unsubstituted alkyl, substituted or unsubstituted aryl, substituted or unsubstituted alkoxy, or hydroxy,
• R5 and R6 are the same or different and are independently substituted or unsubstituted alkylene or substituted or unsubstituted arylene, and
• k is an integer ranging from 1 to 50.