Metallic laminate and manufacturing method of light emitting diode package using the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Gun Chong, Cheol Ho Heo, Sang Hyuk Son, Dae Hyung You
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Gun Chong, Cheol Ho Heo, Sang Hyuk Son, Dae Hyung You
Estimating the term…
The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.
A metallic laminate, comprising:
Dependencies are inferred from the claim text.