Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsNaoki Wakita, Shigeyuki Hayakawa
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AssigneeKabushiki Kaisha Toshiba
InventorsNaoki Wakita, Shigeyuki Hayakawa
Estimating the term…
According to one embodiment, provided is a semiconductor device including a lower layer wiring, and an upper layer wiring that is drawn in the same direction as a direction in which the lower layer wiring is drawn. Intermediate wirings include at least a first intermediate wiring and a second intermediate wiring. Conductors include at least a plurality of first conductors connecting between the lower layer wiring and the first intermediate wiring, a plurality of second conductors connecting between the upper layer wiring and the second intermediate wiring, and a plurality of third conductors which connect between the first intermediate wiring and the second intermediate wiring, and are less in number than the first conductors or the second conductors on a drawn side of the lower layer wiring and the upper layer wiring.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.