Germanium lateral bipolar junction transistor
AssigneeInternational Business Machines Corporation
InventorsJin Cai, Kevin K. Chan, Christopher P. D'Emic, Bahman Hekmatshoartabari, Tak H. Ning, Dae-Gyu Park
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AssigneeInternational Business Machines Corporation
InventorsJin Cai, Kevin K. Chan, Christopher P. D'Emic, Bahman Hekmatshoartabari, Tak H. Ning, Dae-Gyu Park
Estimating the term…
A germanium lateral bipolar junction transistor (BJT) is formed employing a germanium-on-insulator (GOI) substrate. A silicon passivation layer is deposited on the top surface of a germanium layer in the GOI substrate. Shallow trench isolation structures, an extrinsic base region structure, and a base spacer are subsequently formed. A germanium emitter region, a germanium base region, and a germanium collector region are formed within the germanium layer by ion implantation. A silicon emitter region, a silicon base region, and a silicon collector region are formed in the silicon passivation layer. After optional formation of an emitter contact region and a collector contact region, metal semiconductor alloy regions can be formed. A wide gap contact for minority carriers is provided between the silicon base region and the germanium base region and between the silicon emitter region and the germanium emitter region.
A semiconductor structure comprising a bipolar junction transistor (BJT), wherein said BJT comprises:
Dependencies are inferred from the claim text.