Methods and apparatuses for integrated packaging of microelectromechanical devices

A method of packaging a microelectromechanical systems (MEMS) device, comprising:

• forming a chamber sacrificial layer above an insulating layer that is coupled to a wafer;
• forming a packaging layer above the chamber sacrificial layer;
• forming one or more openings through the packaging layer;
• removing the chamber sacrificial layer through the one or more openings;
• forming a sealing layer above the packaging layer such that the sealing layer substantially seals the one or more openings to form a hermetic cavity;
• forming a resonator above the insulating layer comprising:
• forming one or more conductive layers above the insulating layer;
• forming a gap sacrificial layer above the one or more conductive layers;
• forming a resonator beam above the gap sacrificial layer after forming the one or more conductive layers;
• and
• removing the gap sacrificial layer to form an air gap under the resonator beam;
• where forming the resonator is performed prior to forming the chamber sacrificial layer.