Light emitting diode display and method of manufacturing the same
AssigneeSiltron Inc.
InventorsKeon Jae Lee, Sang Yong Lee, Seung Jun Kim
Life of this patent
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Abstract
A method of manufacturing LED display is provided. The method provides a sacrificial substrate on which RGB LED device layers are formed, respectively. The method etches and patterns the LED device layer to manufacture RGB LED devices, respectively. The method removes the sacrificial substrate in a lower side of the LED device. The method contacts a stamping processor to the RGB LED devices to separate the RGB LED devices from the sacrificial substrate. The method transfers the LED device, which is attached to the stamping processor, to a receiving substrate.
Claims15
A method of manufacturing Light Emitting Diode (LED) display, the method comprising:
- (a) forming an LED device layer in a sacrificial substrate;
- (b) etching the LED device layer to manufacture at least two or more LED devices patterned;
- (c) selectively removing the sacrificial substrate in a lower side of the LED device;
- (d) stacking a passivation layer on two or more LED devices to be not removed, which the passivation layer is stacked to the side surface of an LED device requiring no separation, and a part of the passivation layer is formed directly on the sacrificial substrate;
- (e) connecting a stamping processor to the LED devices not screened by the passivation layer, disconnecting the stamping processor, and selectively separating the LED device from the sacrificial substrate by performing an anisotropic etching process, wherein in the anisotropic etching process, a part of the sacrificial substrate is removed in a lower side of a LED device of a region on which the passivation layer is not stacked;
- (f) transferring the LED device, which is attached to the stamping processor, to a receiving substrate;
- and
- (g) removing a part of the passivation layer to selectively separate another LED devices from the sacrificial substrate, and repeating the (e) process at least once;
- wherein LED devices at an interval manufactured in the sacrificial substrate is transferred to the LED display in a relationship by integer times than the interval.
A method of manufacturing Light Emitting Diode (LED) display, the method comprising:
- (a) providing a sacrificial substrate on which RGB LED device layers are formed, respectively;
- (b) etching and patterning the LED device layer to manufacture RGB LED devices, respectively;
- (c) removing the sacrificial substrate in a lower side of the LED device;
- (d) stacking a passivation layer on two or more LED devices to be not removed, which the passivation layer is stacked to the side surface of an LED device requiring no separation, and a part of the passivation layer is formed directly on the sacrificial substrate;
- (e) contacting a stamping processor to the RGB LED devices to separate the RGB LED devices not screened by the passivation layer from the sacrificial substrate by performing an anisotropic etching process, wherein in the anisotropic etching process, a part of the sacrificial substrate is removed in a lower side of a LED device of a region on which the passivation layer is not stacked;
- (f) transferring the LED device, which is attached to the stamping processor, to a receiving substrate;
- and
- (g) removing a part of the passivation layer to selectively separate another LED devices from the sacrificial substrate, and repeating the (e) process at least once;
- wherein LED devices at an interval manufactured in the sacrificial substrate is transferred to the LED display in a relationship by integer times than the interval.
Dependencies are inferred from the claim text.