Polishing composition for nickel phosphorous memory disks
AssigneeCabot Microelectronics Corporation
InventorsSelvaraj Palanisamy Chinnathambi, Haresh Siriwardane
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Abstract
The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel-phosphorous, oxalic acid, optionally, tartaric acid, optionally, a nonionic surfactant, optionally, a biocide, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.
Claims9
A chemical-mechanical polishing composition comprising:
- (a) alpha alumina,
- (b) fumed alumina,
- (c) silica,
- (d) an oxidizing agent that oxidizes nickel-phosphorous,
- (e) about 0.1 wt.% to about 2 wt.% of oxalic acid,
- (f) about 0.1 wt% to 0.75 wt.% tartaric acid,
- (g) a nonionic surfactant,
- (h) optionally, a biocide, and
- (i) water,
- wherein the polishing composition has a pH of about 2 to about 4.
Dependencies are inferred from the claim text.