Sputtering deposition apparatus and backing plate for use in sputtering deposition apparatus
AssigneeToyoda Gosei Co., Ltd.
InventorsHisayuki Miki, Kenzo Hanawa, Yasumasa Sasaki
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Abstract
A backing plate for use in a sputtering deposition apparatus being capable of stably holding Ga, and a sputtering deposition apparatus which is equipped with the backing plate are provided. Such a backing plate for use in a sputtering deposition apparatus is a backing plate for holding a target material which contains Ga, and at least a contact surface of which coming into contact with the target material is constituted from an easily wettable material having a contact angle to Ga in a liquid state of not more than 90°.
Claims8
A sputtering deposition apparatus comprising a backing plate for holding a target material, wherein the target material comprises Ga in a liquid state,
- the backing plate has a contact surface coming into contact with the target material, wherein the contact surface of the backing plate is constituted from an easily wettable material having a contact angle to the Ga in a liquid state of not more than 90°,
- the easily wettable material is selected from the group consisting of silicon, carbon, silicon nitride, aluminum oxide and silicon oxide, and
- the easily wettable material does not contaminate the target material as an impurity.
A backing plate for holding a target material for use in a sputtering deposition apparatus, wherein the target material comprises Ga in a liquid state,
- the backing plate has a contact surface coming into contact with the target material, wherein the contact surface of the backing plate is constituted from an easily wettable material having a contact angle to the Ga in a liquid state of not more than 90°,
- the easily wettable material is selected from the group consisting of a polysilicon, carbon and quartz, and
- the easily wettable material does not contaminate the target material as an impurity.
A sputtering deposition apparatus comprising a backing plate for holding a target material, wherein the target material comprises Ga in a solid state, and
- the backing plate has a contact surface coming into contact with the target material, wherein the contact surface of the backing plate is constituted from an easily wettable material having a contact angle to Ga in a liquid state of not more than 90°,
- the easily wettable material is selected from the group consisting of silicon, carbon, silicon nitride, aluminum oxide and silicon oxide, and
- the easily wettable material does not contaminate the target material as an impurity.
Dependencies are inferred from the claim text.