Ultra smooth face sputter targets and methods of producing same
AssigneeTosoh SMD, Inc.
InventorsTerry L. Banks, David B. Smathers
Life of this patent
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Abstract
A method is provided to remove a thickness of a sputter target surface deformation layer to thereby achieve a reduced burn-in time during sputtering operations. The method comprises extrusion hone polishing of the target surface with a visco-elastic abrasive medium.
Claims19
A method for treating a sputter target surface to remove a thickness of a surface deformation layer including contaminants to thereby achieve a reduced burn-in time during sputtering comprising extrusion hone polishing said target surface by, contacting said target surface with a rheopectic visco-elastic abrasive medium (VEAM) containing abrasive particles and imparting relative motion between said target surface and said medium to thereby extrusion hone polish said target surface, said VEAM retaining said abrasive particles and contaminants, and removing said VEAM from contact with said target surface.
A method for extrusion hone polishing of a radio frequency coil of the type having a surface layer including contaminants, said radio frequency coil adapted for use in plasma generation in a sputtering chamber comprising contacting said surface layer with a rheopectic visco-elastic abrasive medium (VEAM) containing abrasive particles and imparting relative motion between said surface layer and said medium, said VEAM retaining said abrasive particles and contaminants, and removing said VEAM from contact with said coil surface.
Dependencies are inferred from the claim text.