Heat-radiating substrate and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJi Hyun Park, Seog Moon Choi, Young Ki Lee
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Abstract
Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.
Claims2
A heat-radiating substrate, comprising:
- a base substrate with a heat sink, having a groove;
- an insulating layer formed on the entire top surface of the base substrate by performing anodization thereon;
- and
- a circuit layer formed on the insulating layer;
- a printed circuit board disposed on the top of the groove;
- and,
- a device mounted on the printed circuit board.
Dependencies are inferred from the claim text.