Component placement apparatus

A component placement apparatus for moving a mounting head comprising nozzle lines arranged in parallel with each other with respect to a base comprising a substrate transfer path, each of the nozzle lines comprising a plurality of suction nozzles arranged along the substrate transfer path, and for mounting, onto a substrate movably positioned on the substrate transfer path of the base, components sucked to the suction nozzles of the mounting head, said component placement apparatus comprising:

• a component camera that has an imaging surface facing up and obtains an image of a lower surface of the component sucked to the suction nozzle which passes above the component camera;
• a line sensor camera comprising a projector for projecting inspection light in horizontal direction and a line sensor for receiving the inspection light projected by the projector;
• imaging control means for moving the mounting head to allow a component sucked to the suction nozzle of the mounting head before being mounted onto the substrate to horizontally cross the optical axis of the inspection light of the line sensor camera to cause the line sensor camera to perform imaging of the component;
• and
• a controller which determines the propriety of suction attitude of the component with respect to the suction nozzle based on the image of the component obtained through imaging of the component by the line sensor camera, and also determines a positional displacement of the component from the corresponding suction nozzle based on the image obtained by the component camera;
• wherein the projector and the line sensor constituting the line sensor camera are arranged outside the movable region of the mounting head with respect to the base and arranged such that the optical axis of the inspection light crosses a travel orbit of the nozzle line of the mounting head at an angle θ, satisfying 0°<θ≦45° in plan view when the mounting head moves above the component camera and on the travel orbit which is parallel to the substrate transfer pass, and
• wherein the angle θ is an angle between the optical axis of the inspection light and the travel orbit of the nozzle line.