MEMS device and fabrication method thereof
AssigneeSeiko Epson Corporation
InventorsShogo Inaba, Akira Sato, Toru Watanabe, Takeshi Mori
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Abstract
A micro electro mechanical system (MEMS) device includes: a fixed electrode made of silicon and provided above a semiconductor substrate; a movable electrode made of silicon and arranged in a mechanically movable manner by having a gap from the semiconductor substrate; and a wiring layered part that is provided around the movable electrode, covers a portion of the fixed electrode and includes wiring. One of the fixed electrode and the movable electrode is implanted with an impurity ion and at least a part of the portion of the fixed electrode covered by the wiring layered part is silicidized.
Claims12
A micro electro mechanical system device comprising:
- a substrate;
- a fixed electrode formed above the substrate, the fixed electrode including a first portion and a second portion;
- a movable electrode formed above the substrate;
- an insulating layer having an opening, the insulating layer being formed above the first portion of the fixed electrode, the opening being located above the second portion of the fixed electrode;
- a silicide layer formed on at least a part of the first portion of the fixed electrode;
- and
- a wiring layer contacting on the silicide layer,
- wherein the silicide layer is not formed on an entire upper surface of the fixed electrode;
- the movable electrode is formed in a cavity including the opening, and
- an upper surface of the movable electrode is at a height less than a height of the insulating layer.
Dependencies are inferred from the claim text.