Bonding controller guided assessment and optimization for chip-to-chip stacking
AssigneeInternational Business Machines Corporation
InventorsGary Dale Carpenter, Alan James Drake, Eren Kursun
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AssigneeInternational Business Machines Corporation
InventorsGary Dale Carpenter, Alan James Drake, Eren Kursun
Estimating the term…
A method, system, and computer program product for performance-based chip-to-chip stacking are provided in the illustrative embodiments. A first candidate chip is selected from a set of candidate chips for stacking, each candidate chip in the set of candidate chips including an integrated circuit. A part of a 3D performance determinant is activated in the first candidate chip. A value of a performance parameter is measured for a set of operating conditions. A stacked performance value is computed for the first candidate chip using the value. A subset of the set of candidate chips is stacked in a stack, the subset including the first candidate chip, such that a combined value of the performance parameter for the subset when stacked in a first order is within a defined range of values for the performance parameter.
A computer implemented method for performance-based chip-to-chip stacking, the method comprising:
A computer usable program product comprising a computer usable storage device including computer usable code for performance-based chip-to-chip stacking, the computer usable code comprising:
A data processing system for performance-based chip-to-chip stacking, the data processing system comprising:
Dependencies are inferred from the claim text.