Packages for high power operation of optical fiber components

A package for dissipating at least one of heat power or optical power from an optical fiber component of a device, the optical fiber component having a light-guiding core and a cladding surrounding the core, the package comprising:

• a heat sink packaging receptacle for accommodating the optical fiber component, the heat sink packaging receptacle comprising:
• a cavity for receiving a temperature-sensitive portion of the optical fiber component;
• a first end for accommodating an input end of the optical fiber component;
• a second end for accommodating an output end of the optical fiber component;
• and
• at least one channel extending between the cavity and any one of the first end and the second end, the channel being in intimate contact with the cladding of the optical fiber component for dissipating at least one of heat power or optical power from the corresponding one of the input end and output end of the optical fiber component.

A method of packaging a high-power optical fiber component of a device, the method comprising the steps of:

• inserting the optical fiber component into a heat sink substrate having a cavity for receiving a temperature sensitive portion of the optical fiber component;
• introducing a power-dissipative material inside the cavity, the power-dissipative material having heat conducting properties and extending within the cavity so as to contact and surround the temperature sensitive portion of the optical fiber component for dissipating at least one of heat power or optical power from a cladding of said optical fiber component, said power-dissipative material being in a solid or liquid form;
• and
• placing a heat sink cover in substantially mating relation with the heat sink substrate thereby enclosing the optical fiber component and packaging the optical fiber component.