Miniature microphone assembly with hydrophobic surface coating
AssigneeEpcos PTE Ltd.
InventorsChristian Wang, Jörg Rehder, Leif Steen Johansen, Peter Ulrik Scheel
Life of this patent
Estimating the term…
Loading patent…
AssigneeEpcos PTE Ltd.
InventorsChristian Wang, Jörg Rehder, Leif Steen Johansen, Peter Ulrik Scheel
Estimating the term…
A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.
A miniature microphone assembly comprising:
A method of manufacturing a miniature microphone assembly, the method comprising:
Dependencies are inferred from the claim text.