US 8,542,515 B2 · Connection and addressing of multi-plane crosspoint devices

Abstract

A multi-plane circuit structure has at least a first circuit plane and a second circuit plane, and each circuit plane has a plurality of row wire segments, a plurality of column wire segments, and a plurality of crosspoint devices formed at intersections of the row wire segments and the column wire segments. The row and column wire segments have a segment length for forming a preselected number of crosspoint devices thereon. Each row wire segment in the second circuit plane is connected to a row wire segment in the first circuit plane with no offset in a row direction and in a column direction, and each column wire segment in the second circuit plane is connected to a column wire segment in the first circuit plane with an offset length in both the row direction and the column direction. The offset length corresponds to half of the preselected number of crosspoint devices.

Claims15

Dependent claims

A multi-plane circuit structure comprising:

at least a first circuit plane and a second circuit plane, each of the first and second circuit planes having a plurality of row wire segments, a plurality of column wire segments, and a plurality of crosspoint devices formed at intersections of the row wire segments and the column wire segments, each of the row and column wire segments having a segment length for forming a preselected number of crosspoint devices thereon,
wherein each row wire segment in the second circuit plane is connected to a row wire segment in the first circuit plane with no offset in a row direction and in a column direction, and each column wire segment in the second circuit plane is connected to a column wire segment in the first circuit plane with an offset length in both the row direction and the column direction, the offset length corresponding to half of the preselected number of crosspoint devices.

A multi-plane circuit structure comprising:

a plurality of circuit planes and one or more translation layers, each translation layer being disposed between two adjacent circuit planes;
a plurality of chains of connected row wire segments, each chain of connected row wire segments having one row wire segment on each of the circuit planes;
a plurality of chains of connected column wire segments, each chain of connected column wire segments having one column wire segment on each of the circuit planes, every two consecutive column wire segments in the chain being connected to an offset connector segment in a translation layer to provide an offset in both a column direction and a row direction between the two consecutive column wire segments;
wherein the chains of connected row wire segments and the chains of connected column wire segments are disposed such that each chain of connected row wire segments forms at most one intersection with each chain of connected column wire segments;
and
a plurality of crosspoint devices each formed at one of the intersections of the chains of connected row wire segments and chains of connected column wire segments.

3 more elements

Dependencies are inferred from the claim text.

Connection and addressing of multi-plane crosspoint devices

Life of this patent

Connection and addressing of multi-plane crosspoint devices

Life of this patent

Abstract

Claims15