Circuit board having holes to increase resonant frequency of via stubs

An electronic device comprising:

• one or more electrical components;
• and,
• a circuit board on, to, or within which each electrical component is mounted,
• wherein the circuit board comprises:
• a plurality of layers including a first layer, a second layer below the first layer, and a bottom layer;
• a pair of vias filled with a conductive material and extending through the layers, the pair of vias having a pair of via stubs;
• a first pair of conductive signal paths connected to the pair of vias within the first layer;
• a second pair of conductive signal paths connected to the pair of vias within the second layer, such that the pair of via stubs is defined between the second layer and the bottom layer, a differential signal having a frequency to be transmitted between the first pair of conductive signal paths and the second pair of conductive signal paths via the pair of vias;
• and,
• one or more holes extending at least partially through the layers and located between the pair of vias, the holes having a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal.

A circuit board comprising:

• a plurality of layers including a first layer, a second layer below the first layer, and a bottom layer;
• a pair of vias filled with a conductive material and extending through the layers, the pair of vias having a pair of via stubs;
• a first pair of conductive signal paths connected to the pair of vias within the first layer;
• a second pair of conductive signal paths connected to the pair of vias within the second layer, such that the pair of via stubs is defined between the second layer and the bottom layer, a differential signal having a frequency to be transmitted between the first pair of conductive signal paths and the second pair of conductive signal paths via the pair of vias,
• means for increasing a resonant frequency of the pair of via stubs beyond the frequency of the differential signal without backdrilling one or more of the pair of vias.

A circuit board comprising:

• a plurality of layers including a first layer, a second layer below the first layer, and a bottom layer;
• a pair of vias filled with a conductive material and extending through the layers, the pair of vias having a pair of via stubs;
• a first pair of conductive signal paths connected to the pair of vias within the first layer;
• a second pair of conductive signal paths connected to the pair of vias within the second layer, such that the pair of via stubs is defined between the second layer and the bottom layer, a differential signal having a frequency to be transmitted between the first pair of conductive signal paths and the second pair of conductive signal paths via the pair of vias;
• and,
• one or more holes extending at least partially through the layers and located between the air of vias the holes having a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal,
• wherein the holes having the lower dielectric constant than the layers increase the resonant frequency of the pair of via stubs beyond the frequency of the differential signal without having to backdrill one or more of the pair of vias.

An electronic device comprising:

• one or more electrical components;
• and,
• a circuit board on, to, or within which each electrical component is mounted,
• wherein the circuit board comprises:
• a plurality of layers including a first layer, a second layer below the first layer, and a bottom layer;
• a pair of vias filled with a conductive material and extending through the layers, the pair of vias having a pair of via stubs;
• a first pair of conductive signal paths connected to the pair of vias within the first layer;
• a second pair of conductive signal paths connected to the pair of vias within the second layer, such that the pair of via stubs is defined between the second layer and the bottom layer, a differential signal having a frequency to be transmitted between the first pair of conductive signal paths and the second pair of conductive signal paths via the pair of vias;
• and,
• one or more holes extending at least partially through the layers and located between the pair of vias the holes having a lower dielectric constant than the layers to increase a resonant frequency of the pair of via stubs beyond the frequency of the differential signal,
• wherein the holes having the lower dielectric constant than the layers increase the resonant frequency of the pair of via stubs beyond the frequency of the differential signal without having to backdrill one or more of the pair of vias.