Back to results
US 8,541,891 B2Granted
Semiconductor device
AssigneeLapis Semiconductor Co., Ltd.
InventorYoshihiro Saeki
Life of this patent
Estimating the term…
Abstract
A semiconductor device having a first rectangular chip on which wires, electrode pads and chip mounting area are provided, a first dame formed on the first rectangular chip around the electrode pads and the chip mounting area so as to cover the wires and an under fill formed by filling liquid resin between a second rectangular chip mounted on the chip mounting area in a flip-chip manner and the first rectangular chip.
Claims18
A semiconductor device, comprising:
- a first substantially rectangular chip having a top surface on which wires, electrode pads and a chip mounting area are provided;
- a first dam formed on the top surface of the first substantially rectangular chip around the electrode pads and the chip mounting area so as to cover the wires;
- a second substantially rectangular chip mounted on the chip mounting area in a flip-chip manner, the second substantially rectangular chip having first and second sides that are substantially perpendicular to each other in a plan view;
- an under fill formed by filling liquid resin into a space between a top surface of the second substantially rectangular chip and the top surface of the first substantially rectangular chip;
- a second dam formed on the top surface of the first substantially rectangular chip, between the first dam and the first side of the second substantially rectangular chip, and extending along the first side;
- and
- a third dam formed on the top surface of the first substantially rectangular chip, between the first dam and the second side of the second substantially rectangular chip, and extending along the second side, wherein
- the first dam protects the wires and keeps the wires isolated from the liquid resin.
5 more elements
A semiconductor device, comprising:
- a first substantially rectangular chip having a top surface on which wires, electrode pads and a chip mounting area are provided;
- a first dam formed on the top surface of the first substantially rectangular chip around the electrode pads and the chip mounting area, the wires being beneath the first dam and being covered by the first dam;
- a second substantially rectangular chip mounted on the chip mounting area in a flip-chip manner, the second substantially rectangular chip having first and second sides that are substantially perpendicular to each other in a plan view;
- an under fill formed by filling liquid resin into a space between a top surface of the second substantially rectangular chip and the top surface of the first substantially rectangular chip,
- a second dam formed on the top surface of the first substantially rectangular chip, between the first dam and the first side of the second substantially rectangular chip, and extending along the first side;
- and
- a third dam formed on the top surface of the first substantially rectangular chip, between the first dam and the second side of the second substantially rectangular chip, and extending along the second side.
4 more elements
Dependencies are inferred from the claim text.