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US 8,541,890 B2Granted
Substrate based unmolded package
AssigneeFairchild Semiconductor Corporation
InventorRajeev Joshi
Life of this patent
Estimating the term…
Abstract
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead.
Claims35
A semiconductor die package comprising:
- a substrate comprising a lead frame structure having a plurality of leads having lead surfaces at least two die attach regions electrically isolated from each other, and a molding material contacting the lead frame structure, wherein an exterior surface of the molding material is substantially coplanar with the lead surfaces and wherein a major surface of the substrate the at least two die attach regions and the including the exterior surface and the lead surfaces is substantially flat and extends from one edge of the substrate to an opposite edge of the substrate, wherein the lead surfaces are free of the molding material;
- and
- a semiconductor die attached to at least two die attach regions of the major surface of the substrate.
A semiconductor die package comprising:
- a substrate comprising a lead frame structure having a plurality of leads having lead surfaces, and a molding material contacting the lead frame structure, wherein an exterior surface of the molding material is substantially coplanar with the lead surfaces and forms at least part of a flat major surface of the substrate;
- wherein the flat major surface has at least two die attach regions electrically isolated from each other;
- a semiconductor die attached to at least two die attach regions of the flat major surface of the substrate;
- and
- an encapsulating material covering the semiconductor die,
- wherein the encapsulating material is different than the molding material, and
- wherein the lead surfaces are free of the molding material.
4 more elements
A method comprising:
- forming a substrate comprising a lead frame structure having a plurality of leads having lead surfaces and at least two die attach regions, electrically isolated from each other, and a molding material contacting the lead frame structure, wherein an exterior surface of the molding material is substantially coplanar with the lead surfaces and forms at least part of a flat major surface of the substrate;
- and
- attaching a semiconductor die to the at least two die attach regions of the major surface of the substrate.
Dependencies are inferred from the claim text.