Back to results
US 8,541,889 B2Granted
Probe card including frame and cover plate for testing a semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorYang-Gi Kim
Life of this patent
Estimating the term…
Abstract
A probe card includes a main circuit board electrically connected to a tester in order to test a plurality of unpackaged sets of chips, a frame provided on the main circuit board and including a plurality of sockets for respectively receiving the unpackaged sets of chips, probe blocks respectively provided in the sockets and including a plurality of probes electrically connected to input/output terminals of the unpackaged sets of chips, and a cover plate positioned over the frame and including a plurality of pressure members for pressurizing the unpackaged sets of chips in the sockets.
Claims20
A probe card, comprising:
- a main circuit board electrically connected to a tester in order to test at least a first unpackaged set of chips and at least a second unpackaged set of chips;
- a frame provided on the main circuit board, the frame including at least a first socket configured to receive the first unpackaged set of chips and at least a second socket configured to receive the second unpackaged set of chips;
- and
- a cover plate positioned over the frame, the cover plate comprising:
- a first movable member configured to maintain a position of the first unpackaged set of chips in the first socket during testing of the first unpackaged set of chips;
- and
- a second movable member configured to maintain a position of the second unpackaged set of chips in the second socket during testing of the second unpackaged set of chips,
- wherein the first movable member is configured to move independently of the second movable member, and
- wherein the first unpackaged set of chips comprises:
- at least a first chip die including a through-via;
- and
- at least a second chip die stacked on the first chip die and electrically connected the first chip die,
- wherein the first chip and second chip die are not connected to a package substrate.
10 more elements
A probe card, comprising:
- a main circuit board electrically connected to a tester in order to test at least a first unpackaged set of chips and at least a second unpackaged set of chips;
- a frame provided on the main circuit board, the frame including at least a first socket configured to receive the first unpackaged set of chips and at least a second socket configured to receive the second unpackaged set of chips;
- and
- a cover plate positioned over the frame, the cover plate comprising:
- a first pressure member configured to pressurize the first unpackaged set of chips;
- and
- a second pressure member configured to pressurize the second unpackaged set of chips,
- wherein the first pressure member pressurizes the first unpackaged set of chips in a manner different than the second pressure member pressurizes the second unpackaged set of chips,
- wherein the first unpackaged set of chips comprises:
- at least a first chip die including a through-via;
- and
- at least a second chip die stacked on the first chip die and electrically connected the first chip die,
- wherein at least the first input/output terminal of the first unpackaged set of chips is exposed.
10 more elements
A probe card, comprising:
- a main circuit board including a plurality of probes, and electrically connected to a tester in order to test at least a first unpackaged set of chips and at least a second unpackaged set of chips;
- a frame provided on the main circuit board, the frame including at least a first socket configured to receive the first unpackaged set of chips and at least a second socket configured to receive the second unpackaged set of chips;
- and
- a cover plate positioned over the frame, the cover plate comprising:
- a first pressure member configured to pressurize the first unpackaged set of chips such that exposed input/output terminals of the first unpackaged set of chips contact corresponding first probes, wherein the first pressure member is configured to be individually inserted into the first socket to pressurize the first unpackaged set of chips;
- and
- a second pressure member configured to pressurize the second unpackaged set of chips such that exposed input/output terminals of the second unpackaged set of chips contact corresponding second probes, wherein the second pressure member is configured to be individually inserted into the second socket to pressurize the second unpackaged set of chips,
- wherein the first pressure member is configured to move independently of the second pressure member.
5 more elements
Dependencies are inferred from the claim text.