US 8,541,881 B2 · Package structure and manufacturing method thereof

Abstract

A manufacturing method of a package structure is provided. A seed layer is formed on a upper surface of a metal substrate. A patterned dry film layer is formed on a lower surface of the metal substrate and the seed layer. A portion of the seed layer is exposed by the patterned dry film layer. The patterned dry film layer is used as an electroplating mask to electroplate a circuit layer on the portion of the seed layer exposed by the patterned dry film layer. A chip is bonded to and electrically connected to the circuit layer. A molding compound is formed on the metal substrate. The molding compound encapsulates the chip, the circuit layer and the portion of the seed layer. A portion of the metal substrate and a portion of the seed layer are removed so as to expose a portion of the molding compound.

Claims4

Dependent claims

A package structure, comprising:

a metal substrate having an upper surface and a lower surface opposite to each other and a plurality of openings connecting the upper surface and the lower surface;
a circuit layer disposed on the upper surface of the metal substrate;
a chip disposed on the circuit layer and electrically connected to the circuit layer;
and
a molding compound encapsulating the chip and the circuit layer, wherein a bottom surface of the molding compound substantially aligns with the upper surface of the metal substrate, and the openings of the metal substrate expose a portion of the bottom surface of the molding compound.

2 more elements

Dependencies are inferred from the claim text.

Package structure and manufacturing method thereof

Life of this patent

Package structure and manufacturing method thereof

Life of this patent

Abstract

Claims4