Back to results
US 8,541,875 B2Granted
Integrated three-dimensional module heat exchanger for power electronics cooling
AssigneeAlliance for Sustainable Energy, LLC
InventorsKevin Bennion, Jason Lustbader
Life of this patent
Estimating the term…
Abstract
Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.
Claims25
A circuit element, comprising:
- a semiconductor package having opposing first and second sides;
- a heat exchanger plate having opposing first and second sides, the first side of the semiconductor package connected to the first side of the heat exchanger plate at a base of the heat exchanger plate, the heat exchanger plate having a wing not connected to the semiconductor package, the wing integrally formed with the base of the heat exchanger plate and extending from the base beyond a first edge of the semiconductor package;
- the base of the heat exchanger plate in thermal communication with the semiconductor package such that heat generated in the semiconductor package flows out through the first side of the semiconductor package into the base of the heat exchanger plate;
- the wing of the heat exchanger plate in thermal communication with the base of the heat exchanger plate such that heat in the base flows into the wing;
- and
- a cooling element connected to the first side of the heat exchanger plate at the wing of the heat exchanger plate, the cooling element in thermal communication with the wing of the heat exchanger plate such that heat in the wing flows into the cooling element.
3 more elements
A method of cooling a power electronics switch in an electric vehicle, comprising:
- generating heat in a semiconductor portion of a power electronics switch by passage of current through the switch between a first electric subsystem and a second electric subsystem of an electric vehicle;
- removing heat from the semiconductor by passage of heat through a surface of the semiconductor into a base of a heat exchanger plate;
- removing heat from the base of the heat exchanger plate by passage of heat along a length of the heat exchanger plate into a wing of the heat exchanger plate;
- and
- removing heat from the wing of the heat exchanger plate by passage of heat through first and second opposing surfaces of the wing of the heat exchanger plate.
2 more elements
A circuit element, comprising:
- a semiconductor package having opposing first and second sides;
- a heat exchanger plate connected to the first side of the semiconductor package at a base of the heat exchanger plate, the base of the heat exchanger plate in thermal communication with the semiconductor package such that heat generated in the semiconductor package flows out through the first side of the semiconductor package into the base of the heat exchanger plate;
- the heat exchanger plate having a first wing not connected to the semiconductor package, the first wing integrally formed with the base of the heat exchanger plate and extending from the base beyond a first edge of the semiconductor package, the first wing of the heat exchanger plate in thermal communication with the base of the heat exchanger plate such that heat in the base flows into the first wing;
- the heat exchanger plate having a second wing not connected to the semiconductor package, the first wing integrally formed with the base of the heat exchanger plate and extending from the base beyond a second edge of the semiconductor package, the second wing of the heat exchanger plate in thermal communication with the base of the heat exchanger plate such that heat in the base flows into the second wing;
- a first cooling element connected to the first heat exchanger plate at the first wing of the heat exchanger plate, the first cooling element in thermal communication with the first wing of the heat exchanger plate such that heat in the first wing flows into the first cooling element;
- and
- a second cooling element connected to the heat exchanger plate at the second wing of the heat exchanger plate, the second cooling element in thermal communication with the second wing of the heat exchanger plate such that heat in the second wing flows into the second cooling element.
4 more elements
A method of cooling a power electronic switch in a electric vehicle, comprising:
- driving a first current through a power electronics switch;
- removing heat generated in the power electronics switch by the first current by passing a first coolant fluid through a first cooling element;
- driving a second current through the power electronics switch;
- removing heat generated in the power electronics switch by the second current by passing the first coolant fluid through the first cooling element and by passing a second coolant fluid through a second cooling element.
1 more element
A circuit element, comprising:
- a first module comprising a semiconductor package and a heat exchanger plate connected to the semiconductor package at a base of the heat exchanger plate, the heat exchanger plate having a wing not connected to the semiconductor package, the wing integrally formed with the base of the heat exchanger plate and extending from the base beyond a first edge of the semiconductor package;
- a second module comprising a semiconductor package and a heat exchanger plate connected to the semiconductor package at a base of the heat exchanger plate, the heat exchanger plate having a wing not connected to the semiconductor package, the wing integrally formed with the base of the heat exchanger plate and extending from the base beyond a first edge of the semiconductor package;
- and
- a cooling element connected to the first and second modules in a stacked arrangement such that the wing of the heat exchanger plate of the first module is connected to a first side of the cooling element, and a second side of the cooling element is connected to the wing of heat exchanger plate of the second module;
- wherein
- the cooling element is not connected to a least a portion of the base of the heat exchanger plate of the first module and not connected to at least a portion of the base of the heat exchanger plate of the second module such that a void space exists adjacent the cooling element and between the bases of the heat exchanger plates of the first and second modules.
3 more elements
Dependencies are inferred from the claim text.