Microelectronic packages having cavities for receiving microelectronic elements

A packaged microelectronic element, comprising:

• a package element, said package element including:
• a first dielectric element having a bottom face and a top face remote from said bottom face;
• a plurality of package contacts and a plurality of first chip contacts exposed at said top face, said first chip contacts being connected to said package contacts,
• a second dielectric element having a bottom face adjacent to said package contacts and a top face remote from said bottom face, said second dielectric element overlying said top face of said first dielectric element and having openings aligned with said package contacts;
• a plurality of second chip contacts exposed at said bottom face of said second dielectric element;
• a first microelectronic element having a plurality of bond pads connected to said chip contacts;
• and
• a second microelectronic element having bond pads connected to said second chip contacts.