Multilayered lead frame for a semiconductor light-emitting device

A semiconductor light-emitting device comprising:

• a package that includes a cover made of a transparent resin and a base made of an insulating resin;
• a lead including an inner part enclosed with the package and an outer part that is outside the package;
• and
• a semiconductor light-emitting element mounted on the inner part of the lead, wherein:
• an outermost coating of the inner part includes a first area covered with a first metal coating and a second area having a second metal coating,
• the cover is in contact with the first area,
• the first metal coating has higher light reflectance than the second metal coating, and
• the semiconductor light-emitting element is mounted on the first area.

A semiconductor light-emitting device comprising:

• a package that includes a cover made of a transparent resin and a base made of an insulating resin;
• a lead including an inner part enclosed in the package and an outer part that is outside the package;
• and
• a semiconductor light-emitting element mounted on the inner part of the lead, wherein:
• an outermost coating of the inner part includes a first area and a second area, the first area including silver or silver-alloy, the second area including gold or gold-alloy,
• the cover is in contact with the first area,
• the lead includes a nickel or nickel-alloy coating, and a palladium or palladium-alloy coating,
• in the first area, the nickel or nickel-alloy coating, the palladium or palladium-alloy coating, and the silver or silver-alloy are applied in the stated order,
• in the second area, the nickel or nickel-alloy coating, the palladium or palladium-alloy coating, and the gold or gold-alloy are applied in the stated order,
• the nickel or nickel-alloy coating and the palladium or palladium-alloy coating substantially entirely cover the lead,
• the silver or silver-alloy substantially entirely covers the lead, and
• in the second area, the nickel or nickel-alloy coating, the palladium or palladium-alloy coating, the silver or silver-alloy, and the gold or gold-alloy are applied in the stated order.