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US 8,541,822 B2Granted
Semiconductor device and method for producing the same
AssigneeSharp Kabushiki Kaisha
InventorMasayuki Tajiri
Life of this patent
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Abstract
A semiconductor device comprising at least two wiring layers on a substrate or a surface layer of the substrate, wherein a lower wiring layer of the two wiring layers contains silicon, and a silicon carbide layer is placed between the lower wiring layer and an upper wiring layer.
Claims6
A semiconductor device comprising:
- at least two wiring layers on a silicon substrate or a surface layer of the silicon substrate, wherein a lower wiring layer of the two wiring layers contains silicon;
- a silicon carbide layer between the lower wiring layer and an upper wiring layer;
- a gate electrode located on the silicon substrate via a gate insulating film;
- a channel located on a surface layer of the silicon substrate under the gate electrode;
- a pair of drift layers having the channel therebetween in a channel-length direction;
- and
- silicon layers located on each of the pair of drift layers and working as a source/drain, wherein
- the lower wiring layer is the pair of drift layers and the upper wiring layer is the source/drain.
5 more elements
A method for producing a semiconductor device, the semiconductor device comprising:
- a gate electrode located on a silicon substrate via a gate insulating film;
- a channel located on a surface layer of the silicon substrate under the gate electrode;
- a pair of drift layers having the channel therebetween in a channel-length direction;
- and
- a silicon layer located on each of the pair of drift layers and working as a source/drain, wherein
- a lower wiring layer is the pair of drift layers, an upper wiring layer is the source/drain, and the silicon carbide layer is located between the drift layers and the source/drain,
- the method comprising the steps of:
- forming a silicon carbide layer on the lower wiring layer or a surface layer of the lower wiring layer, the lower wiring layer being composed of silicon and formed on the silicon substrate or a surface layer of the silicon substrate;
- and
- forming the upper wiring layer on the silicon carbide layer;
- wherein the lower wiring layer is the pair of drift layers and the upper wiring layer is the source/drain.
8 more elements
Dependencies are inferred from the claim text.